Jobid=3e90aec659b4 (0.0997)
About this position
TNO is the Netherlands Organisation for Applied Scientific Research. As an independent research institute, TNO connects science and industry to accelerate innovation and translate knowledge into practical, scalable solutions. By combining deep technical expertise with a strong application focus, TNO supports companies and governments in addressing complex technological and societal challenges. Within the semiconductor domain, TNO plays a leading role in the development of advanced chip packaging technologies through the Chip Integration Technology Center (CITC). Under the CITC brand, TNO collaborates with industry leaders, materials suppliers, and equipment manufacturers to strengthen Europe’s position in semiconductor packaging and to enable the next generation of high-performance electronic systems. Through its Advanced Packaging Platform, TNO develops and scales innovative fan-out packaging technologies built on decades of expertise in large-area processing, thin-film electronics, and additive manufacturing. This platform combines advanced infrastructure, including a dedicated back-end lab in Nijmegen and state-of-the-art cleanroom facilities for thin-film and additive manufacturing processes at the Eindhoven campus.
What will be your role?
Within the Advanced Packaging Platform at CITC, you will contribute to the development of next-generation chip packaging technologies for demanding applications such as automotive radar systems and high-frequency RF and mmWave devices.
As Scientist Advanced Chip Packaging, you will be actively involved in the full development cycle of advanced packaging solutions, from design and realization to experimental validation and characterization. Your work will focus on enabling reliable and scalable chip packaging technologies that integrate different semiconductor materials such as CMOS and III-V devices.
You will work at the intersection of materials science, microelectronics, and advanced packaging technologies. In this multidisciplinary R&D environment, you will collaborate closely with experts in materials engineering, device fabrication, modelling, and system integration.
In this role, you will combine hands-on experimental work with thermomechanical modelling and device characterization. Your work will contribute to the development of manufacturable and reliable packaging solutions that can be translated into industrial applications.
You will also collaborate closely with industrial partners and customers, translating real-world technology challenges into concrete development activities and technology roadmaps.
Key responsibilities:
What we expect from you
You are a hands-on researcher with a strong technical background and a deep interest in advanced semiconductor packaging technologies.
You bring:
What we offer:
What you'll get in return
Challenging and varied work with a real impact. And plenty of opportunities as, at TNO, you are in charge of shaping your career. We offer a gross monthly salary (based on your knowledge and experience), 8% holiday pay, a 13th month bonus of 8.33% and a flex budget (5.58% + € ). In addition, you will be given every opportunity to develop yourself.
TNO offers optional employee benefits, enabling you to tailor your benefits package to match your personal situation. You may also expect:
Read about tailoring your benefits package.
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