R&D Scientist – Chip Packaging – S[&]T – Nijmegen

Jobid=A.0.049

Direct message the job poster from S[&]T

Talent Acquisition Consultant at S[&]T – Space for a Safer Life

At S[&]T we contribute to a safer life on Earth by translating space data into valuable and actionable insights. With this, we help organizations, governments and commercial entities to strengthen their information position and thereby improve their decision-making. We focus on 4 domains: Space & Science, Defence & Security, Environment & Sustainability and the High-Tech Industry. We control all levels of the data value chain from data source to user applications, and apply our expertise within our innovations, customer projects and talent acquisition services. Our headquarters are in Delft, The Netherlands and we have two satellite offices in Oslo, Norway and Rome, Italy with a total of 125 experts employed at S[&]T.

We are currently looking for a R&D Scientist to join the team in Nijmegen.

As an R&D Scientist, you will develop advanced chip packaging technologies for different applications, from automotive radar to photonics and power electronics. You will work in a multidisciplinary research environment that will allow you to conduct experiments and thrive in the intersection of the following fields: material science, packaging technology and microelectronics.

This role is primarily based in Nijmegen, but you will also work occasionally in Eindhoven.

Responsibilities:

• You will be involved in the design, realization, and characterization of next-generation advanced packages.
• You will conduct experiments and model to develop and demonstrate novel processes, focusing on manufacturability and reliability.
• You will engage with external stakeholders, translating industry needs into technology development.
• You will design, fabricate, and conduct reliability testing of advanced packages.
• You will participate in technology and process development.

Requirements:

• You have a Master’s Degree in Mechanical Engineering, Electrical Engineering, Materials Science or Physics.
• You have at least 5 years of experience in R&D in the advanced chip packaging domain. Experience with fan-out technologies is a plus.
• You have expertise in reliability testing and modelling techniques.
• You have a hands-on mentality with the ability to organize practical work efficiently and cooperatively.
• You are proficient in data handling, analysis and the communication of the results.
• You have a good command of the English language and excellent communication skills.

Interested? Then click to apply or send your CV and motivational letter to recruitment@stcorp.nl.

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Please note that if you do not hear back from us within 10 days of your application, you may assume that we have selected another candidate we would like to interview for this position. We do our best to get back to you individually, however, due to a high volume of responses, it can be that we have not been able to reject your application in person.

Seniority level

• Mid-Senior level

Employment type

• Full-time

Job function

• Science and Engineering
• Industries
• Semiconductor Manufacturing

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