Jobid=627646763244987329 (0.0995)
About this position
TNO is the Netherlands Organisation for Applied Scientific Research. As an independent research institute, TNO connects science and industry to accelerate innovation and translate knowledge into practical, scalable solutions. By combining in-depth technical expertise with a strong application focus, TNO supports companies and governments in addressing complex technological and societal challenges.
Within the semiconductor sector, TNO plays a leading role in the development of advanced chip packaging technologies through Chip Integration Technology Center (CITC). Under the CITC brand, TNO collaborates with industry leaders, materials suppliers, and equipment manufacturers to strengthen Europe’s position in semiconductor packaging and enable the next generation of high-performance electronic systems.
Through its innovation programs, TNO develops and scales innovative die attach and assembly technologies to improve the performance and reliability of power electronics. This work is carried out in the back-end laboratory in Nijmegen, which is equipped with state-of-the-art packaging and assembly equipment.
What will be your role?
As a Senior Process Engineer, you work at the intersection of packaging design, process development, materials science and semiconductor assembly technologies. You are actively involved in the entire development cycle of advanced die attach solutions and new packages for power electronics, from design and realization to experimental validation and characterization. You collaborate directly with industrial partners and customers to translate technology concepts into manufacturable products. You lead the design and experimental work in multiple customer and internal research projects and are part of a multidisciplinary and international team.
Key responsibilities:
Defining and optimizing assembly processes and production flows for new die attach technologies, including developing processes for thin die assembly (50 µm and smaller).
Designing packages and packaging components for power electronics, e.g. lead frames and clips.
Designing tooling for packaging manufacturing and assembly, including lead frame tooling, vacuum pick-up tools and other product-specific fixtures.
Setting up, executing and analysing Design of Experiments (DoE) for materials and process development.
Analysing experimental results and translating findings into process improvements and technological recommendations.
Programming and operating advanced packaging and assembly equipment.
Reporting technical progress and results to customers and project stakeholders.
Technical supervision of students and junior engineers.
What we expect from you
Minimum of 8 years of experience in semiconductor packaging development.
Extensive knowledge of semiconductor assembly and packaging technologies.
Experience with packaging and tooling design using 2D and 3D design software like AutoCAD and/or SolidWorks.
Proven experience with DoE methodologies, data analysis, and experimental process development.
Experience with advanced assembly, die attach and interconnection technologies.
Knowledge of Ag and Cu sintering processes is highly desirable.
A hands-on mentality and the ability to independently plan and execute technical work.
Strong communication skills and the ability to present technical results in English to industrial customers and partners.
What you'll get in return
Challenging and varied work with a real impact. And plenty of opportunities as, at TNO, you are in charge of shaping your career. We offer a gross monthly salary (based on your knowledge and experience), 8% holiday pay, a 13th month bonus of 8.33% and a flex budget (5.58% + € ). In addition, you will be given every opportunity to develop yourself
TNO offers optional employee benefits, enabling you to tailor your benefits package to match your personal situation. You may also expect:
An extremely professional, innovative working environment where colleagues are leading experts in their field.
The opportunity to attend courses, workshops and conferences, and to receive training and coaching based on your needs.
33 days annual leave plus a flexible holiday that can be used on a cultural, religious, or otherwise important day of your choosing (on a full-time basis).
An employer working towards a where every employee can flourish, with various initiatives such as , numerous expertise based guilds, Rainbow Community and Round Tables on diverse inclusion topics.
We offer a comprehensive and flexible that also includes full compensation for public transportation for commuting and business travel.
Great social events with your team and other . That’s how you will get to know a lot of people really quickly.
Flexible working hours, the possibility to work parttime (32 or 36 hours) and the possibility of working from home.
Extensive for international candidates.
A good pension scheme.
Read about tailoring your benefits package.
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